ENGR PRIN, EXTERNAL MANUFACTURING_TL
ON Semiconductor
 Union Springs, NY

[Responsibilities:]

  • Final
    test technical lead to support Transfer and NPD projects before production
    release.
  • Early
    involvement in cross functional projects for setting/align manufacturing
    requirement, test solution robustness validation, process control setup to
    ensure release success.
  • Responsible
    for driving final test technical root cause analysis, resolve engineering
    roadblocks, from samples/engineering setup until mass production to support
    business schedule.
  • Work
    closely with cross functional teams (eg, internal BU, operation, external
    suppliers) for any final test related topics during project execution, and
    review manufacturability setup.
  • Represent
    final test release gate as part of project core team, support and review test
    data analysis package, action items closure, Agile documentation, and sign-off
    for production release.

[Requirements:]

  • Bachelor’s
    Degree in Electrical Engineering or equivalent. Minimum 10 years of final test
    manufacturing experience in Semiconductor industry.
  • Experience
    of final test transfer, setup and correlation activities, NPI validation for
    release, with controlled CPK, GR&R, guard banding test limits,
    system/process variance control.
  • Familiar
    with final test data analysis, establish statistical bin limit, performance
    analysis tools (6-sigma, Data Power, Exensio, Galaxy or QlikView).
  • Demonstrated
    track records of final test problem solving skills and yield improvement
    activities.
  • Knowledge of different test technology platform (eg,
    ETS88, ETS800, ETS364, ASL1K, Advantest etc) and hardware configurations is preferred.